E-news ESSCIRC/ESSDERC 2013
Pilot issue, 29th of January, 2013
European Solid-State Electron Circuits Conference (ESSCIRC 2013 is the 39th edition) forms a joint event with European Solid-State Electron Devices Conference (ESSDERC 2013 is the 43rd edition), under the aegis of IEEE. The generic site of ESSCIRC is http://www.esscirc.org/en/page/home.aspx etc. Here you can find the following general description:
"The aim of the ESSDERC conference is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and technologies. ESSDERC and its sister conference ESSCIRC, which deals with solid-state circuits, are jointly organised.
The increasing level of integration for system-on-chip design made available by advances in silicon technology requires a deeper interaction amongst technologists, device physicists and circuit designers. While keeping separate Technical Programme Committees, ESSDERC and ESSCIRC will share plenary keynote presentations and tutorials bridging both communities. Delegates registered for either conference are encouraged to attend any of the scheduled parallel sessions.
Although it is called "European", the double event has a true international participation with about half of the incoming papers originating from other regions of the globe, mostly Asia and North America. The overall average acceptance rate of proposed papers is around 40%. The papers are published in Proceedings, available during the Conference.
In 2013, the twin conference will be hosted for the first time in Eastern Europe (Bucharest, Romania). On this occasion, an increased participation from the Eastern part of Europe is expected.
The Organizing Committee is doing its best in preparing the Conference highest technical standards. The selection of papers will be done by reputed specialists from various countries within Technical Programme Committees.
back PAPER SUBMISSION The 2013 ESSDERC conference will allow only electronic submission of papers in PDF format. Prospective authors must submit their paper(s) via the conference website. Papers must be submitted in the final format to be published in the proceedings. They must not exceed four A4 pages with all illustrations and references included. The size of the PDF files submitted must not exceed 2MB. Manuscript guidelines as well as instructions on how to submit electronically will be available on the conference website.
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Joint ESSCIRC/ESSDERC plenary talks, confirmed speakers
- Reinhard Ploss (CEO Infineon) “Automotive electronics and energy efficiency”
- Jesus del Alamo (MIT) “Nanometer-scale InGaAs Field-Effect Transistors for THz and CMOS technologies”
ESSDERC plenary talks, confirmed speakers
- Tsunenobu Kimoto (Kyoto University, Japan) “SiC devices for ultrahigh-voltage applications”
- Livio Baldi (ST Micro) “Emerging memories”
- Kaustav Banerjee (Univ. Calif. Santa Barbara) “2D Electronics: graphene and beyond”
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